At Pack Expo International 2014, Bosch Packaging Technology, a leading supplier of processing and packaging solutions, will showcase its complete systems competence, from processing to primary and secondary packaging to end-of-line technologies.
Two high-speed Seamless Systems designed to maximize Overall Equipment Effectiveness (OEE) will be featured, including the global launch of the enhanced blow-fill-seal (BFS) packaging line. Also displayed will be the company’s Module++ capabilities, which link Bosch’s proven standard modules for customized processing and packaging solutions. To create each line, Bosch draws from its local support combined with a global knowledge network.
“Whether searching for high-end systems from processing to case packing, or taking the first steps with packaging automation, food and nonfood manufacturers are seeking a single-source solutions provider,” said Paul Garms, marketing manager, Bosch Packaging Technology, Inc., New Richmond. “Bosch’s wide portfolio of systems technologies ensures that manufacturers are equipped with the right solution to stay competitive in a constantly evolving market.”
Food manufacturers can learn more about Bosch’s latest system solutions in the South Hall, booth S-3514 at PACK EXPO International in Chicago, Illinois, United States, November 2 to 5.